Where we can have impact
Through the heterogenous integration of compound semiconductors within silicon CMOS, we are bringing together the best characteristics of III-V materials and silicon on one monolithic integrated circuit (IC). Such chips will open up opportunities to impact design and development within vital areas of future technology. Learn more
Our chips underpin:
Augmented Reality (AR)
The next-gen of AR products and glasses.
Virtual Reality (VR)
Breakthrough innovations in VR-related devices.
Smart lighting in architectural design and displays.
Future products within wearable technologies.
Key illumination components in tomorrow's vehicles.
Effective connectivity in 5G networks and beyond.